Business Introduction
制作、焊接、物料采购一站式服务
丰富的生产线资源,满足各种制造加工需求
实时跟踪生产进度,严格进行品质管控
专业DFM技术支持,全程提供可制造性优化方案
集中产线,充分实现成本控制
制板
焊接
设计
物料
组装
√ 单面板
√ 双面板
√ 多层板
√ HDI板
√ FPC软板
√ 铝基板
√ 高TG板
√ 高频板
√ 厚铜板
√ 混压板
√ 金属基板
√ 无卤素板
PCB Fabrication
Layer count | 2 to 40L |
Maximum Panel size | 533×610mm 21i×24i |
Minimum Board thickness | 0.60mm 0.024i |
Maximum Board thickness | 2.4mm 0.0945i |
Minimum core thickness (I/L) | 0.75mm 0.003i |
Minimum Cu thickness (Base) | 1/3 oz 12um |
Maximum Cu thickness (Base) | 2.0 oz 70um |
Drilling Hole to hole accuracy | ±0.075mm ±0.003i |
Routing Edge to Edge accuracy | ±0.10mm ±0.004i |
Stamping Edge to Edge accuracy | ±0.076mm ±0.003i |
Vee-cut Edge to Edge accuracy | ±0.127mm ±0.005i |
PTH Tolerance | ±0.05mm |
NPTH Tolerance | ±0.076mm/-0mm ±0.003i/-0i |
Min.drill size | 0.2mm 0.0078i |
Aspect Ratio | 6:1 |
Trace width tolerance (≥4mils) | ±20% |
Minimum trace width | 0.076mm 0.003i |
Registration (O/L) | ±0.076mm ±0.003i |
Material Purchase
丰富的现货资源,满足多品种、中小批量、快速等多样化需求
正规授权的采购渠道,确保产品性能和质量
整合订单、集中采购、有效降低人力和物流等采购成本
专业技术团队支持,提供库存、采购、咨询等一站式服务
SCM
Memory
LogicIC
Diode
Diode
Transistor
Capacitor
Resistance
AnaiogIC
Sensor
Connector
Switch
Battery
Crystal
Fuse
Wireless